RESEARCH

Current Research Projects

• Microsystems Assembly Technology for the 21st Century

• Lead Free Soldering for Flip-Chip Assembly

• Novel Manufacturing Process for Silver Production

• Unstructured Grid Generation Technologies

• Turbulence Modelling at Low Reynolds Numbers

• Optimisation Technologies for Multiphysics Simulations

• Visco-Elastic Fluid Flow on Unstructured Grids

• Assembly and Performance of Optoelectronic Components

• Multi-physics modelling of Arterial Flow

Previous Research Projects

• Modelling the Flip-Chip Assembly Process

• Physical and Computational Modelling of Metal Refining Process

• Large strain analysis using finite volume methods.